High-Power Electronics Module Specialized Water-Cooling Aluminum Profile

Formed from high-purity aluminum through tight-tolerance extrusion, this profile is engineered specifically for liquid cooling applications. The design incorporates internal sealed channels or micro-fin arrays that direct the flow of coolant precisely over the heat source footprint. The extrusion process is vital here because it creates a monolithic structure with zero risk of internal leakage between channels-a common failure point in brazed or welded assemblies. The key benefit is the ultra-low thermal resistance from the IGBT baseplate to the coolant, allowing power electronics to operate at full rated current without derating. These profiles are critical for cooling IGBT stacks, rectifier bridges in frequency inverters, EV charging piles, and SVG static var generators. As semiconductor technology moves toward Silicon Carbide (SiC) and Gallium Nitride (GaN), which operate at higher frequencies and temperatures, the demand for more sophisticated cooling geometries is rising. The trend is toward extrusions with turbulator features and pin-fin structures inside the water channel, as well as composite designs where aluminum extrusions are paired with copper inlays to manage extreme heat flux.

• Superior heat dissipation: 3-5 times higher efficiency than air cooling, ideal for high-power IGBT/SiC modules.
• Lightweight & high strength: Aluminum extrusion (6063/6061) with excellent thermal conductivity and low cost.
• Low thermal resistance & uniform temperature: Reduces hotspots and extends module service life.
• Integrated structure: One-piece water channel, no leakage risk, easy for modular design.
• Wide adaptability: Works stably in high temperature, humidity and dusty environments; low noise.
• Corrosion resistance: Surface treatment (anodizing, coating) ensures long industrial lifespan.

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